Product
Silverbead TP100X thermal pad – level gaps, transfer heat reliably
The TP100X is an elastic gap-filler thermal pad for compensating height differences between heatsink and component. It is available in five thicknesses from 0.5 to 3.0 mm and in packs of 1, 2 or 3. Select the required variant above.
Key features
- Thermal conductivity: 2.4 W/m·K
- Five thicknesses from 0.5 to 3.0 mm
- Compensates for unevenness and manufacturing tolerances
- Non-adhesive – ideal when the heatsink is screwed on
- Can be cut to size with scissors
- For graphics cards, VRAM, VRM, chipsets, LEDs and Peltier/TEC modules
Note: The pad is not self-adhesive. For adhesive mounting, use Silverbead SG100X/SG100XS thermal adhesive.
Technical data
- Model TP100X
- Dimensions 100 x 20 mm
- Thickness 0.5 / 1.0 / 1.5 / 2.0 / 3.0 mm
- Thermal conductivity 2.4 W/m·K
- Colour Grey
- Operating temperature −50 °C to 140 °C
Scope of delivery: 1 x TP100X thermal pad in the selected thickness and pack size
Applications
Derived from the industries of our business customers and the products they buy from us.
- Graphics card repair VRAM and voltage converters, replacing old pads (0.5–1 mm).
- M.2 SSD and chipset thin pads under the cooler where paste would be squeezed out.
- Display and panel construction industrial panel PCs and touch displays.
- Measuring instruments and medical technology large pad areas, sensors and reference bodies.
- Marine sensor technology electronics in underwater housings.
How to use
- Peel off the protective film on both sides.
- Cut the pad to the required size.
- Place the pad between component and heatsink.
- Press the heatsink evenly or screw it down.
Need larger quantities regularly?
Tell us what you use it for and how much you need.