Silverbead thermal adhesive – bond heatsinks permanently and transfer heat (10 g)
Not every heatsink can be screwed or clipped into place. Silverbead thermal adhesive fills the gap between component and heatsink, creates more contact area and bonds both permanently. It is electrically non-conductive – a safe choice for closely spaced contacts too.
Key features
- Bond heatsinks permanently – without screws or clips
- Bonding and heat transfer in one step
- Electrically non-conductive – no short-circuit risk if a little goes astray
- Dielectric strength: 4 kV
- Strong adhesion, even for heavy heatsinks
- Slightly elastic after curing – compensates stress and dampens vibration
- Touch-dry after 20 minutes, fully cured after 12 hours
- Application nozzle for precise dosing
Suitable for: ICs, VRM, MOS, transistors, LEDs, RAM and VRAM, CPUs, mainboards, chipsets, graphics cards, high-power LEDs, Peltier/TEC modules, Raspberry Pi, ODROID-N2, LCD TVs, laptops and PCs.
Note: Close tightly after use, store at room temperature and protect from dust. Keep out of reach of children.
Technical data
- Thermal conductivity 1.2 W/m·K
- Operating temperature −50 °C to 140 °C
- Flash point 200 °C
- Dielectric strength 4 kV
- Colour White
- Recommended layer thickness 0.1–0.5 mm
- Curing touch-dry after 20 minutes, fully cured after 12 hours
- Content 10 g
Scope of delivery: 1 x Silverbead thermal adhesive, 10 g, incl. application nozzle
Applications
Derived from the industries of our business customers and the products they buy from us.
- EMS service provider heatsinks in device assembly, small series and prototypes.
- LED manufacturer COB LEDs and LED modules onto heatsinks.
- Sensor and measurement technology thermal bonding of sensors in probes.
- Batteries and storage sensors and power electronics in modules.
- Panel and display construction heatsinks on assemblies where no screws are possible.
How to use
- Clean the component and heatsink thoroughly of dust and grease – ideally with 99% isopropanol.
- Apply a thin layer (0.1–0.5 mm) with the application nozzle; a dot in the centre is usually enough.
- Place the heatsink and press evenly. Secure it if necessary so that it does not shift while curing.
- Leave to cure for 20 minutes; full strength is reached after about 12 hours.
Adhesive, paste or pad? The adhesive is intended for permanent bonds. If you want to remove the cooler later, thermal paste or a thermal pad is the better choice.
Need larger quantities regularly?
Tell us what you use it for and how much you need.
